This product is made of polyester film as the substrate, coated with organic silicon pressure-sensitive adhesive and baked together. It is attached to fluorine release film and can easily peel off the tape after die-cutting. It is particularly suitable for electronic manufacturers to produce on assembly lines. With different molds, it can be die-cut into different shapes for customers. It can work in an environment of 260 ℃, with excellent peel off and adhesive properties, and is widely used for shielding and protection of electronic components.
→ Fluorine release membrane | |
→ silica gel | |
→ mylar |
Indicator Name | Detected data |
Backing | 0.05mm mylar |
Coefficient of the tape | silica gel |
Color | Green |
Thickness mm | 0.08 |
Meter-long | 100M |
Width | 500mm |
ensileStrengthN/25mm | ≥120 |
longation% | ≥70 |
Breakdown strength | ≥150 |
Withstand VoltageKV | 5 |
AdhesionN/25mm | ≥8 |
Temperature Resistance℃ | 200℃ |
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